Toyo Ink SC Holdings Co., Ltd., the Japan-based parent company of the specialty chemicals company Toyo Ink Group, announced that its Corporate R&D Division has developed a silver (Ag) nanoparticle paste for die-attach applications. The newly developed lead-free material can be sintered at low temperatures under both pressure-less and pressure-assisted methods. It has been engineered to meet the need for higher heat resistance and heat dissipation properties of electrical interconnects use...